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LPKF MicroLine 2000 Ci

LPKF MicroLine 2000 Ci

Automated UV Laser for Depaneling of Rigid and Flexible PCBs

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Compact, high-output and inline-capable. The technology driving the MicroLine 2000 Ci is based on the proven MicroLine 1000 series. It follows the same new modern machine layout as the first system and also has a few things to offer under the hood.

Process advantages due to laser technology

Compared to conventional tools, laser processing offers a compelling series of advantages.
  • The laser process is completely software-controlled. Varying materials or cutting contours are easily taken into account through adapting the processing parameters and laser paths. There is no need to factor in retooling times during a change of production.
  • In the case of laser cutting with the UV laser, no appreciable mechanical or thermal stresses occur. The ablation products are extracted by suction directly at the cutting channel. Even sensitive substrates can thus be precisely processed.
  • The laser beam merely requires a few µm as a cutting channel. More components can thus be placed on a panel.
  • The system software differentiates between operation in production and setting up processes. That clearly reduces instances of faulty operation.

Integration in production lines

An integrated SMEMA interface and a newly developed handling system allow the MicroLine 2000 systems to be integrated in the customers’ own production lines. They help the production managers there: The laser system can cut any contours without mechanical conversions and allows production runs with high variance.

Higher throughput

LPKF laser systems can often create components conforming to standards out of deformed base materials. In the MicroLine 2000 Ci, a highly developed vision system is used that can make corrections in the position and rotation angle of the component. The laser beam follows the contours of the real component position.

The integrated vision system and the internal infeed were further optimized for the MicroLine 2000 Ci so as to minimize non-productive time. In this way, the system can be equipped with a high-output laser source - the processing times thus drop once more and the maximum thickness of the material to be processed rises.

Integration in MES Solutions

The MicroLine 2000 Ci seamlessly integrates into existing manufacturing execution systems (MESs). The laser system delivers operative parameters, machine data, tracking & tracing values and information about individual production runs.

LPKF MicroLine 2000
Cutting PCBs and cover layers with the LPKF MicroLine 2000 systems.
Scoring, drilling and cutting of fired ceramics
Cutting, drilling and engraving of unfired ceramic (green tape).
Cutting, drilling and engraving of unfired ceramic (green tape).
Highly precise structuring of metal layers on ceramics

Processing of TCO/ITO layers without impairment of substrate
Each laser pulse removes an exactly defined amount of material. Depths can thus be precisely controlled.
LPKF MicroLine 2000 S PCB Rigid Flex
The UV laser separates flexible from rigid PCB components.
LPKF MicroLine 2000 S PCB Depaneling (Minimal Cutting Channels)
Minimal cutting channels allow a better depaneling.

LPKF MicroLine 2000 S PCB Depaneling (Close Cutting)
The UV laser cuts closely to the edge of components and circuit paths.
LPKF MicroLine 2000 S PCB Depaneling (1.6 mm)
Depending on the laser source, LPKF cutting systems can separate PCBs up to a thickness of 1.6 mm.


Technical Data
LPKF MicroLine 2000 Ci
Laser class 1
Max. working area
(X x Y x Z)
300 mm x 250 mm x 11 mm
(11.8” x 9.8” x 0.4”)
Max. recognition area
(X x Y)
300 mm x 250 mm
(11.8” x 9.8”)
Max. material size
(X x Y)
300 mm x 250 mm
(11.8” x 9.8”)
Data input formats Gerber, X-Gerber, DXF, HPGL, Sieb & Meier, Excellon, ODB ++
Max. structuring speed Depends on application
Accuracy ± 25 μm (1 mil)
Diameter of focussed laser beam 20 μm (0.8 mil)
Laser wavelength 355 nm
System dimensions
(W x H x D)
875 mm x 1 530 mm x 1 300 mm*
(34.5” x 60.2” x 51.2”)
Weight ~ 450 kg (~ 990 pounds)
Operating conditions
Power supply 230 VAC, 50-60 Hz, 3 kVA
Cooling Air-cooled (internal water-air cooling)
Compressed air 0.6 MPa (87 PSI)
Ambient temperature 22 °C ± 2 °C @ ± 25 μm / 22 °C ± 6 °C @ ± 50 μm
(71.6 °F ± 3.6 °F @ 1 Mil / 71.6 °F ± 10.8 °F @ 2 Mil)
Humidity < 60 % (non-condensing)
Required accessoires Exhaust unit, external conveyor, production fixture

* Height incl. StatusLight = 2020 mm (79.6”)

MicroLine 2000 Ci series systems feature multiple variations:
MicroLine 2120 Ci (10 watt laser source), MicroLine 2820 Ci (15 watt laser source), MicroLine 2920 Ci (18 watt laser source) and MicroLine 2000 Ci (27 watt laser source).

Brochure LPKF MicroLine 2000 Ci
PDF download

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