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LPKF MicroLine 2000 P

LPKF MicroLine 2000 P

Precision Cutting for Printed Circuit Boards and Cover Layers

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General
The LPKF MicroLine 2000 systems can process even highly complicated tasks with printed circuit boards (PCBs). They are available in variants for cutting assembled PCBs, flexible PCBs and cover layers.

Process advantages due to LPKF MicroLine 2000 systems

Compared to conventional tools, laser processing offers a compelling series of advantages.
  • The laser process is completely software-controlled. Varying materials or cutting contours are easily taken into account through adapting the processing parameters and laser paths.
  • In the case of laser cutting with the UV laser, no appreciable mechanical or thermal stresses occur.
  • The laser beam merely requires a few µm as a cutting channel. More components can thus be placed on a panel.
  • The system software differentiates between operation in production and setting up processes. That clearly reduces instances of faulty operation.
  • The fiducial recognition by the integrated vision system is done in the latest version around 100% faster than before.


MicroLine 2000 P - Processing Flat Substrates

UV laser cutting systems display their advantages at various positions in the production chain. With complex electronic components, the processing of flat materials is sometimes required.
In that case, the UV laser reduces the lead time and total costs with every new product layout. The LPKF MicroLine 2000 P is optimized for these work steps.

  • Complex contours
  • No substrate brackets or cutting tools
  • More panels on the base material
  • Perforations and decaps


Integration in MES Solutions

The MicroLine 2000 P seamlessly integrates into existing manufacturing execution systems (MESs). The laser system delivers operative parameters, machine data, tracking & tracing values and information about individual production runs.


Pictures
LPKF MicroLine 2000
Cutting PCBs and cover layers with the LPKF MicroLine 2000 systems.
Scoring, drilling and cutting of fired ceramics
Cutting, drilling and engraving of unfired ceramic (green tape).
Cutting, drilling and engraving of unfired ceramic (green tape).
Highly precise structuring of metal layers on ceramics

Processing of TCO/ITO layers without impairment of substrate
Each laser pulse removes an exactly defined amount of material. Depths can thus be precisely controlled.
New cutting contours can be easily loaded with the respective software.
The contact-free laser cutting can handle even complex cutting contours.



Video



Technical Data
LPKF MicroLine 2000 P
Clase de láser 1
Tamaño máx. de material (X x Y x Z) 350 mm x 350 mm x 11 mm
Zona máx. de reconocimiento de marcas (X x Y) 300 mm x 300 mm
Formato de datos Gerber, X-Gerber, DXF, HPGL, Sieb & Meier, Excellon, ODB ++
Velocidad máxima de estructuración Depende de la aplicación
Precisión del sistema ± 25 μm*
Diámetro de rayo láser enfocado 20 μm
Longitud de onda del láser 355 nm
Dimesiones del sistema (ancho x alto x profundo) 875 mm x 1 530 mm x 1 300 mm
Peso ~ 450 kg
Datos técnicos de funcionamiento
Suministro eléctrico 230 VAC, 50-60 Hz, 3 kVA
Refrigeración Refrigeración por aire (circuito interno de refrigeración)
Temperatura ambiente 22 °C ± 2 °C
Humedad del aire < 60 % (que no se condensa)
Accesorios necesarios Unidad de succión


* Height incl. StatusLight = 2 020 mm (79.5”)

MicroLine 2000 P series systems feature multiple variations:
MicroLine 2120 P (10 watt laser source) and MicroLine 2820 P (15 watt laser source).

Brochure LPKF MicroLine 2000 P
PDF download

More Information



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